Author:
Inoue Fumihiro,Jourdain Anne,Peng Lan,Phommahaxay Alain,De Vos Joeri,Rebibis Kenneth June,Miller Andy,Sleeckx Erik,Beyne Eric,Uedono Akira
Funder
IMEC’s Industrial Affiliation Program
Harold Philipsen
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference25 articles.
1. A wafer–scale 3–D circuit integration technology;Burns;IEEE Trans. Electron Devices,2006
2. Thinned wafer multi-stack 3DI technology;Ohba;Microelectron. Eng.,2010
3. Characterization of extreme Si thinning process for wafer-to-wafer stacking;Inoue;IEEE 66th, Electronic Components and Technology Conference,2016
4. Cu retardation performance of extrinsic gettering layers in thinned wafers evaluated by transient capacitance measurement;Lee;J. Electrochem. Soc.,2011
5. Grinding of silicon wafers: a review from historical perspectives;Pei;Int. J. Mach. Tools Manuf.,2008
Cited by
29 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献