Thinned wafer multi-stack 3DI technology

Author:

Ohba Takayuki,Maeda Nobuhide,Kitada Hideki,Fujimoto Koji,Suzuki Kousuke,Nakamura Tomoji,Kawai Akihito,Arai Kazuhisa

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Forming electrical interconnections through semiconductor wafers

2. Y. Akasaka, T. Nishimura, Concept and basic technologies for 3D IC structure, IEEE IEDM Tech. Dig. (1986) 488.

3. T. Kunio, K. Oyama, Y. Hayashi, M. Morimoto, 3D ICs having 4-stacked active layers, IEEE IEDM Tech. Dig. (1989) 837.

4. P. Garrou, C. Bower, P. Ramm (Eds.), Handbook of 3D Integration Technology and Application of 3D Integration Circuits, Wiley-VCH Verlag GmbH & Co., KGaA, 2008.

5. N. Maeda, H. Kitada, K. Fujimoto, K. Suzuki, T. Nakamura, T. Ohba, Novel and production-worthy wafer-on-a-wafer (WOW) technology using self-aligned TSV (SALT) interconnect, in: Advanced Metallization Conference 2008, Mat. Res. Soc. 501 (2009).

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