Wafer Thinning for 3D Integration
Author:
Affiliation:
1. Yokohama National University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/26/1/26_172/_pdf
Reference19 articles.
1. 1) Z. Dong and Y. Lin: "Ultra-Thin Wafer Technology and Applications: A Review," Materials Science in Semiconductor Processing Vol. 105, April 2019, 104681, 2020, doi: 10.1016/j.mssp.2019.104681
2. 2) Z. J. Pei, G. R. Fisher, and J. Liu: "International Journal of Machine Tools & Manufacture Grinding of Silicon Wafers: A Review from Historical Perspectives," Vol. 48, pp. 1297–1307, 2008, doi: 10.1016/j.ijmachtools.2008.05.009
3. 3) Z. J. Pei, G. R. Fisher, M. Bhagavat, and S. Kassir: "A Grinding-Based Manufacturing Method for Silicon Wafers: An Experimental Investigation," Vol. 45, pp. 1140–51, 2005, doi: 10.1016/j.ijmachtools.2004.12.006
4. 4) 福島誉史,李 康旭,田中 徹,小柳光正:“半導体ウエハへの三次元配線加工:Tsv と狭ピッチ電極を中心に,”表面技術,Vol. 67, No. 8, pp. 414–420, 2016
5. 5) Y. Yang, K. De Munck, R. C. Teixeira, B. Swinnen, B. Verlinden, and I. De Wolf, n.d.: "Process Induced Sub-Surface Damage in Mechanically Ground Silicon Wafers," 075038. doi: 10.1088/0268-1242/23/7/075038
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