A grinding-based manufacturing method for silicon wafers: an experimental investigation-Reference-Cited by-同舟云学术

A grinding-based manufacturing method for silicon wafers: an experimental investigation

Published:2005-08 Issue:10 Volume:45 Page:1140-1151
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Pei Z.J.,Fisher Graham R.,Bhagavat Milind,Kassir S.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference47 articles.

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