3D Interconnect Technologies Based on TSV and Fine-Pitch Electrode-Reference-Cited by-同舟云学术

3D Interconnect Technologies Based on TSV and Fine-Pitch Electrode

Published:2016 Issue:8 Volume:67 Page:414-420
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

FUKUSHIMA Takafumi¹²³,LEE Kang-Wook²,TANAKA Tetsu¹⁴,KOYANAGI Mitsumasa²

Affiliation:

1. Dept. of Mechanical Systems Engineering, Tohoku University

2. New Industry Creation Hatchery Center(NICHe), Tohoku University

3. University of California, Los Angeles (UCLA), Electrical Engineering Department

4. Dept. of Biomechanical Engineering, Tohoku University

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/67/8/67_414/_pdf

Reference51 articles.

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4. 4）K. W. Lee, T. Nakamura, T. Ono, Y. Yamada, T. Mizukusa, H. Hashimoto, K. T. Park, H. Kurino, M. Koyanagi ; Tech. Dig. IEDM, 165（2000）.

5. 5）M. Koyanagi, Y. Nakagawa, K.-W. Lee, T. Nakamura, Y. Yamada, K. Inamura, K.-T. Park, H. Kurino ; Proc. 48th ISSCC, 270（2001）.

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