Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration
Author:
Affiliation:
1. Tokyo Institute of Technology,Kanagawa,Japan,226-8503
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129700.pdf?arnumber=10129700
Reference5 articles.
1. Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)
2. High-throughput Thermal Compression Bonding of 20um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking;xie;Proc IEEE 66th Electron Compon Technol Conf (ECTC),2016
3. Deformation Characteristics of Micron-level Thin Adhesive Layer for Bumpless Build Cube (BBCube) Integration Technology
4. An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor
5. Thinned wafer multi-stack 3DI technology
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