The influence of sub-surface damage microstructure on ultra-thin die flexural strength-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The influence of sub-surface damage microstructure on ultra-thin die flexural strength

Published:2024-07 Issue: Volume:31 Page:3790-3800
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Shu Liu,Li Chongyang,Wu Yunwen^ORCID,Hang Tao,Liu Lei,Li Ming

Publisher

Elsevier BV

Reference58 articles.

1. Ultra-thin chips for high-performance flexible electronics;Gupta;Npj Flexible Electronics,2018

2. Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives;Malik;Microelectron Reliab,2021

3. An improved three-point bending test method for the investigation of nanosecond laser dicing of ultrathin Si dies with Cu stabilization layer;Marks;Mater Char,2018

4. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending;Van den Ende;Microelectron Reliab,2014

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP