Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference25 articles.
1. Ultrathin wafer pre-assembly and assembly process technologies: a review;Marks;Crit. Rev. Solid State Mater. Sci.,2015
2. Effect of nanosecond laser dicing on the mechanical strength and fracture mechanism of ultrathin Si dies with Cu stabilization layer;Marks;IEEE Trans. Compon. Packag. Manuf. Technol.,2015
3. Standard Test Methods for Flexural Properties of Ceramic Whiteware Materials,2013
4. Test Method for Measurement of Die Strength by Mean of 3-Point Bending,2003
5. Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials,2003
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