Corrosion protection of ENIG surface finishing using electrochemical methods-Reference-Cited by-同舟云学术

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Corrosion protection of ENIG surface finishing using electrochemical methods

Published:2010-03 Issue:3 Volume:45 Page:305-308
ISSN:0025-5408
Container-title:Materials Research Bulletin
language:en
Short-container-title:Materials Research Bulletin

Author:

Bui Q.V.,Nam N.D.,Choi D.H.,Lee J.B.,Lee C.Y.,Kar A.,Kim J.G.,Jung S.B.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference20 articles.

1. Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys

2. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

3. Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

4. Intermetallic compounds formed at the interface between Cu substrate and an Sn–9Zn–0.5Ag lead-free solder

5. The interdiffusion of Sn from AuSn solder with the barrier metal deposited on diamond

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1. Effect of benzotriazole on the prevention of electroless nickel–immersion gold treated copper corrosion;Journal of Physics and Chemistry of Solids;2023-05

2. Localised aqueous corrosion of electroless nickel immersion gold-coated copper;Corrosion Engineering, Science and Technology;2022-07-06

3. Influence mechanism of Au layer thickness on wettability of Sn–Ag–Cu solder on heated ENIG pads;Vacuum;2022-07

4. Thiourea-Based Extraction and Deposition of Gold for Electroless Nickel Immersion Gold Process;Industrial & Engineering Chemistry Research;2020-04-01

5. Electrochemical characterization of plasma coatings on printed circuit boards;Progress in Organic Coatings;2019-12

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