Intermetallic compounds formed at the interface between Cu substrate and an Sn–9Zn–0.5Ag lead-free solder-Reference-Cited by-同舟云学术

Intermetallic compounds formed at the interface between Cu substrate and an Sn–9Zn–0.5Ag lead-free solder

Published:2003-04 Issue:5 Volume:38 Page:909-916
ISSN:0025-5408
Container-title:Materials Research Bulletin
language:en
Short-container-title:Materials Research Bulletin

Author:

Chang Tao-Chih,Hon Min-Hsiung,Wang Moo-Chin

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference23 articles.

1. Wetting and interface microstructure between Sn–Zn binary alloys and Cu

2. Thermodynamic prediction of interface phases at Cu/solder joints

3. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys, American Society for Metals, Metals Park, Ohio, 1973, p. 151.

4. R. Hultgren, P.D. Deasi, D.T. Hawkins, M. Gleiser, K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys, American Society for Metals, Metals Park, Ohio, 1973, p. 795.

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging;Soldering & Surface Mount Technology;2018-02-05

2. Low temperature In–Bi–Zn solder alloy on copper substrate;Journal of Materials Science: Materials in Electronics;2015-11-05

3. Characterization of low speed shear test reliability of Sn–1.0Ag–XCe/ENEPIG solder joint;Journal of Alloys and Compounds;2013-05

4. Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints;Materials Letters;2012-11

5. Suppression of interfacial intermetallic compounds between Sn–9Zn solder and Cu-substrate by adding Cu-particles in the solder;Journal of Materials Science: Materials in Electronics;2011-10-14