Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
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3. Segregate-induced cavitation of Sn/Cu reactive interface;Liu;Scr Mater,2005
4. The effect of post-bake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates;Kim;Mater Lett,2008
5. Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu;Suh;Appl Phys Lett,2007
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1. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process;Journal of Materials Science: Materials in Electronics;2023-06
2. Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient;Journal of Materials Science;2023-02-27
3. High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process;Materials Chemistry and Physics;2022-10
4. Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint;Intermetallics;2022-06
5. Domain structure of pseudosymmetric η″-ordered Cu6Sn5 by EBSD analysis;Acta Materialia;2022-05
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