Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface-Reference-Cited by-同舟云学术

Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

Published:2003-07 Issue:22-23 Volume:57 Page:3361-3365
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Ma Xin,Wang Fengjiang,Qian Yiyu,Yoshida Fusahito

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference23 articles.

1. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, An Analysis of the Current Status of Lead-Free Soldering, NPL and ITRI Report, 1999.

2. IPC Roadmap, A Guide for Assembly of Lead-Free Electronics, 2000.

3. Lead-free Solders in Microelectronics

4. Advances in lead-free electronics soldering

5. Kinetics of interfacial reaction in bimetallic CuSn thin films

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