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Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys

  • Published:2008-06 Issue:2-3 Volume:109 Page:386-391
  • ISSN:0254-0584
  • Container-title:Materials Chemistry and Physics
  • language:en
  • Short-container-title:Materials Chemistry and Physics

Author:

Rosalbino F.,Angelini E.,Zanicchi G.,Marazza R.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference34 articles.

1. US Environmental Protection Agency, Strategy for Reducing Lead Exposure, 21 February, 1991.

2. US Environmental Protection Agency, Advanced Notice of Rulemaking, 13 May, 1991.

3. US Environmental Protection Agency, Comprehensive Review of Lead in the Environmental under TSCA, 56 FR 22096-98, 13 May, 1991.

4. Lead-free solder Materials, COST Action 531, http://www.univie.ac.at/cost5531/.

5. Bismuth activity in lead-free solder Bi–In–Sn alloys

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