Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows-Reference-Cited by-同舟云学术

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Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

Published:2007-10-10 Issue:1 Volume:37 Page:118-124
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Koo Ja-Myeong,Vu Bui Quoc,Kim Yu-Na,Lee Jong-Bum,Kim Jong-Woong,Kim Dae-Up,Moon Jeong-Hoon,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0301-7.pdf

Reference16 articles.

1. M. Bigas, E. Cabrija, Microelectron. Eng. 83, 399 (2006)

2. M. Abtew, G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000)

3. H. Nayeb-Hashemi, P. Yang, Int. J. Fatigue 23, 325 (2001)

4. K.N. Tu, K. Zeng, Mater. Sci. Eng. R 34, 1 (2001)

5. J.M. Koo, S.B. Jung, Microelectron. Eng. 82, 569 (2005)

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1. Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound;Journal of Electronic Materials;2022-10-12

2. Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering;Materials & Design;2015-12

3. Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn–Ag–Cu solder alloy;Journal of Alloys and Compounds;2014-06

4. Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates;Journal of Electronic Materials;2013-05-25

5. RESEARCH ON MICROSTRUCTURE OF Pb-FREE BGASOLDER JOINT ASSEMBLED WITH Sn-Pb SOLDERDURING ISOTHERMAL AGING;Acta Metallurgica Sinica;2013

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