Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering

Author:

Qu WenqingORCID,Zhou Shuangshuang,Zhuang Hongshou

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference32 articles.

1. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic;Shnawah;Microelectron. Reliab.,2012

2. The Basics of Soldering;Rahn,1993

3. Solder joint technology: material, properties, and reliability;Tu,2007

4. Interfacial reaction between 95Pb5Sn solder bump and 37Pb63Sn presolder in flip-chip solder joints;Chang;J. Electron. Mater.,2010

5. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng.,2000

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