Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests-Reference-Cited by-同舟云学术

Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests

Published:2023-05 Issue: Volume:24 Page:8967-8983
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Chen Chuantong^ORCID,Kim Dongjin,Liu Yang,Sekiguchi Takuya,Su Yutai^ORCID,Long Xu,Liu Canyu,Liu Changqing,Suganuma Katsuaki

Funder

JSPS

Japan Society for the Promotion of Science

New Energy and Industrial Technology Development Organization

Murata Science Foundation

Engineering and Physical Sciences Research Council

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

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