Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform-Reference-Cited by-同舟云学术

Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

Published:2024-07 Issue:19 Volume:35 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Heo Min-Haeng,Seo Young-Jin,Yoon Jeong-Won^ORCID

Funder

National Research Foundation of Korea

Korea Institute for Advancement of Technology

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10854-024-13132-z.pdf

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