Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures-Reference-Cited by-同舟云学术

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Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

Published:2024-05 Issue: Volume:30 Page:8433-8450
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Wang Xinyue^ORCID,Chen Haixue,Yang Zhoudong,Liu Wenting,Zeng Zejun,Zhang Guoqi,Zhang Jing,Fan Jiajie^ORCID,Liu Pan^ORCID

Publisher

Elsevier BV

Reference51 articles.

1. Electric-drive vehicle power electronics thermal management: current status, challenges, and future directions;Moreno;J Electron Packag,2022

2. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Qin;J Phys Appl Phys,2023

3. Reliability of wide band gap power electronic semiconductor and packaging: a review;Wang;Energies,2022

4. Review of silver nanoparticle based die attach materials for high power/temperature applications;Paknejad;Microelectron Reliab,2017

5. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans Compon Packag Manuf Technol,2011

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography;Materials & Design;2024-08

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