Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield;Harman,1997
2. Wirebonding at higher ultrasonic frequencies: reliability and process implications
3. Advanced process characterization for 125 kHz wire bonder ultrasonic transducers
4. Fully process-compatible layout design on bond pad to improve wire bond reliability in CMOS ICs
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