Predictions of frame compliance and apex morphology in sharp nanoindentations-Reference-Cited by-同舟云学术

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Predictions of frame compliance and apex morphology in sharp nanoindentations

Published:2015-10 Issue: Volume:38 Page:342-345
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Kim Ki-Bok,Lee Yun-Hee,Kim Yongil,Park Jongseo,Ahn Seung-min,Kim Ju-Young

Funder

Converging Research Center Program through the Ministry of Education, Science and Technology

Korea Research Council of Fundamental Science and Technology (KRCF)

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Determination of hardness and Young's modulus for important III–V compound semiconductors

2. Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests

3. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

4. Comparison of nano-indentation hardness to microhardness

5. Determination of indenter tip geometry and indentation contact area for depth-sensing indentation experiments

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