Wirebonding at higher ultrasonic frequencies: reliability and process implications-Reference-Cited by-同舟云学术

Wirebonding at higher ultrasonic frequencies: reliability and process implications

Published:2003-01 Issue:1 Volume:43 Page:141-153
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Charles H.K,Mach K.J,Lehtonen S.J,Francomacaro A.S,DeBoy J.S,Edwards R.L

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Wirebonding––towards 6σ yield and fine pitch;Harman,1992

2. Electronic materials and packaging structures for multichip modules;Charles;Electron Packag.,1992

3. Wirebonding on various multichip module substrates and metallurgies;Charles,1997

4. Wirebonding: Re-inventing the process for MCMs;Charles,1998

5. High frequency wirebonding: Its impact on bonding machine parameters and MCM substrate bondability;Charles,2001

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A new vibratory response-based method for determining the optimal assembly tightening torque of the high-frequency piezoelectric ultrasonic transducer;Journal of Applied Physics;2023-07-10

2. A new type of dual-branch composite structure-based ultrasonic transducer for microelectronic interconnection and packaging;Applied Acoustics;2022-10

3. Effect of mechanical compliance of mounting clamp on electrical properties and vibration response of high-frequency piezoelectric ultrasonic transducer for microelectronic packaging and interconnection;Sensors and Actuators A: Physical;2022-03

4. Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading;Journal of Mechanics;2022

5. Harmonic excitation response performance and active regulation of the high-frequency piezoelectric ultrasonic transducer used in the thermosonic bonding for microelectronics;Sensors and Actuators A: Physical;2020-04