New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al-Reference-Cited by-同舟云学术

New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al

Published:2004-06 Issue:6 Volume:44 Page:973-981
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Breach C.D.,Wulff F.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Dittmer K, Kumar S, Wulff F. Intermetallic growth in small ball bonds. Proceedings of SEMICON Singapore, Test, Assembly and Packaging, May 1998. p. 267–72

2. Chemical kinetics of solids;Schmalzreid,1995

3. Physical Metallurgy;Haasen,1996

4. Gold–aluminum intermetallics: ball bond shear testing and thin film reaction couples;Clatterbaugh;IEEE Trans. Compon., Hybrids Manuf.,1984

5. The effect of high temperature intermetallic growth on ball shear induced cratering;Clatterbaugh;IEEE Trans. Compon., Hybrids Man.,1990

Cited by 74 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA;Journal of Materials Science: Materials in Electronics;2024-08

2. Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging;Micromachines;2023-07-31

3. Calculation of Mechanical Properties, Electronic Properties, and Thermodynamic Properties of AuAl Crystal: First‐Principles Calculation;Crystal Research and Technology;2023-05-24

4. Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process;Materials Characterization;2021-10

5. Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175∘C;Microelectronics International;2019-12-09