Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process-Reference-Cited by-同舟云学术

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Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process

Published:2021-10 Issue: Volume:180 Page:111401
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Wang Shang,Zhang He,Hang Chunjin,Feng Jiayun,Sa Zicheng,Li Yue,Zhang Weiwei,Tian Yanhong

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference33 articles.

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3. A study on the design parameters for MEMS oscillators incorporating nonlinearities;Li;IEEE Trans. Circuits Syst. I Regul. Pap.,2018

4. 5.5GHz system z microprocessor and multi-chip module;Warnock,2013

5. Designing “dual personality” IEEE 1149.1 compliant multi-Chip modules;Jarwala;J. Electron. Test.,1997

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5. Joining mechanism of parallel gap resistance welded dissimilar connection between Ag interconnector and GaAs solar cell: A transmission electron microscopy study;Materials Characterization;2023-01

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