Author:
Kamto A.,Liu Y.,Schaper L.,Burkett S.L.
Funder
United States Air Force Research Laboratories
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Proc. Electronic Components and Technology Conference;Beica,2008
2. High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking
3. Proc. Electronic Components and Technology Conference;Jang,2007
4. “Why 3-D TSV is hotter than hot”, Semiconductor International;Vardaman,2008
Cited by
34 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献