Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ac31cd/pdf
Reference34 articles.
1. Integrated circuit packaging review with an emphasis on 3D packaging;Lancaster;Integr. VLSI J.,2018
2. Carbon nanotube based 3-D interconnects—a reality or a distant dream;Kaushik;IEEE Circuits Syst. Mag.,2014
3. Through silicon Via reliability;Cassidy;IEEE Trans. Device Mater. Reliab.,2012
4. Thermal management in TSV based 3D IC integration: a survey;Sanipini;Mater. Today:. Proc,2021
5. A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems;Dang;IEEE Access,2020
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