Atmospheric Gas-Phase Catalyst Etching of SiO<sub>2</sub> for Deep Microfabrication Using HF Gas and Patterned Photoresist-Reference-Cited by-同舟云学术

Atmospheric Gas-Phase Catalyst Etching of SiO₂ for Deep Microfabrication Using HF Gas and Patterned Photoresist

Author:

Sano Ko-hei¹²^ORCID,Ono Yoshitaka²,Tobinaga Ryosuke²,Imamura Yutaka²,Hayashi Yasuo²,Yanagitani Takahiko¹³⁴⁵

Affiliation:

1. Graduate School of Advanced Science and Engineering, Waseda University, Tokyo 169-8555, Japan

2. Innovative Technology Laboratories, AGC Incorporated, Kanagawa 230-0045, Japan

3. Kagami Memorial Research Institute for Material Science and Technology, Waseda University, Tokyo 169-0051, Japan

4. JST CREST, Saitama 332-0012, Japan

5. JST FOREST, Saitama 332-0012, Japan

Funder

Core Research for Evolutional Science and Technology

Adaptable and Seamless Technology Transfer Program through Target-Driven R and D

Japan Society for the Promotion of Science

Fusion Oriented REsearch for disruptive Science and Technology

Publisher

American Chemical Society (ACS)

Link

Reference46 articles.

1. Laermer, F.; Schilp, A. Method for Anisotropically Etching Silicon. GE 1992.

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