Influence of alloying elements on stability and electronic structures of Cu6Sn5(0 1 0) surface by first principles calculations-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Influence of alloying elements on stability and electronic structures of Cu6Sn5(0 1 0) surface by first principles calculations

Published:2017-02 Issue: Volume:127 Page:230-235
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Dai J.H.,Shi B.,Hu Z.Z.,Quan H.Y.,Song Y.

Funder

Natural Science Foundation of Shandong

Weihai construction projects

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference41 articles.

1. Development of SnAg-based lead free solders in electronics packaging

2. Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives

3. Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

4. Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation;Materials Today Communications;2023-12

2. Stability and electronic properties of low-index surfaces of zinc stannate modulated by vacancy defect: A first-principle study;Physica B: Condensed Matter;2023-06

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP