Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference16 articles.
1. Properties of lead-free solder alloys with rare earth element additions
2. Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
3. Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating
4. Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate
5. Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys
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1. Influence of bismuth (Bi) addition on the structure and properties of annealed Sn-9Zn eutectic binary solder alloy;Advances in Materials and Processing Technologies;2020-10-21
2. Effect of Minor Addition of Ni on the Microstructure and Properties of Zn-Based High-Temperature Solder;Journal of Electronic Materials;2020-04-02
3. Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders;Journal of Materials Science: Materials in Electronics;2019-12-14
4. Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging;Modern Physics Letters B;2019-02-28
5. A critical review on performance, microstructure and corrosion resistance of Pb-free solders;Measurement;2019-02
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