Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference10 articles.
1. Microstructure evolution of eutectic Sn-Ag solder joints
2. McCormack M, Jin S, Kammlott GW. In: Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, May 1–3 1995, Orlando, FL, USA. p. 171–6
3. Hua F, Glazer J. Design & reliability of solders and solder interconnections. In: TMS Annual Meeting, 1997. p. 65
4. Development of fluxes for lead-free solders containing zinc
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