Development of fluxes for lead-free solders containing zinc
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference3 articles.
1. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
2. Investigation of multi-component lead-free solders
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1. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method;Journal of Materials Science: Materials in Electronics;2023-01-31
2. Structure and Properties of SnBi/Cu Composite Lead-free Solder;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Flux Modification for Wettability and Reliability Improvement in Solder Joints;Recent Progress in Lead-Free Solder Technology;2022
4. Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 ≤ x ≤ 20.2) solder alloys prepared by high-throughput strategy;Manufacturing Letters;2021-01
5. Influence of SiC nanoparticles addition on the microstructure, thermal and tensile properties of Sn–Zn–Ag solder alloy;Materials Research Express;2018-07-18
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