Influence of SiC nanoparticles addition on the microstructure, thermal and tensile properties of Sn–Zn–Ag solder alloy
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/aad25c/pdf
Reference29 articles.
1. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
2. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn–Zn and Sn–Pb solders
3. Lead-free Solders in Microelectronics
4. Issues related to the implementation of Pb-free electronic solders in consumer electronics
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1. Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase;Advanced Engineering Materials;2024-05-28
2. Enhancing the microstructural, optical, and tensile properties of the PVC‐PMMA blend film: The role of PbO nanoparticles incorporation;Journal of Applied Polymer Science;2023-07-07
3. Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation;Journal of Composite Materials;2022-06-28
4. The role of MgO nanoparticles addition, and γ-irradiation on the microstructural, and tensile properties of Al-1100 alloy;Journal of Composite Materials;2021-01-11
5. Microstructure, mechanical properties, and drop reliability of CeO2 reinforced Sn–9Zn composite for low temperature soldering;Materials Research Express;2019-02-06
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