Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 ≤ x ≤ 20.2) solder alloys prepared by high-throughput strategy
Author:
Funder
National Key Research and Development Program of China
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials
Reference29 articles.
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4. Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition;Journal of Materials Science: Materials in Electronics;2023-07
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