Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment
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Scientific Research Publishing, Inc.
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders;Journal of Materials Science: Materials in Electronics;2024-08
2. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09
3. Electrochemical behavior of Sn-9Zn-xCu solder alloy in 3.5 wt% NaCl solution at room temperature;Materials Today Communications;2022-12
4. Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 ≤ x ≤ 20.2) solder alloys prepared by high-throughput strategy;Manufacturing Letters;2021-01
5. Enhanced microstructural, thermal and tensile characteristics of heat treated Sn-5.0Sb-0.3Cu (SSC-503) Pb-free solder alloy under high pressure;Materials Science and Engineering: A;2019-01
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