Electrochemical behavior of Sn-9Zn-xCu solder alloy in 3.5 wt% NaCl solution at room temperature
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference58 articles.
1. Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic;Zhang;J. Mater. Sci. Mater. Electron.,2019
2. Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder joint interface during different thermal conditions;Li;J. Mater. Sci. Mater. Electron.,2015
3. Mechanism of solder joint cracks in anisotropic conductive films bonding and solutions: delaying hot-bar lift-up time and adding silica fillers;Zhang;Metals,2018
4. L. C. Tsao, Corrosion characterization of Sn37Pb solders and with Cu substrate soldering reaction in 3.5wt.% NaCl solution, in: Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, Aug. 2009, 1164–1166. doi: 10.1109/ICEPT.2009.5270611.
5. The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders;Lin;Mater. Chem. Phys.,1998
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1. Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems;Physica Scripta;2023-10-11
2. Study on the preparation and properties of Sn–0.7Cu–xBi alloy;RSC Advances;2023
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