Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers
Author:
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/8/1/42/pdf
Reference15 articles.
1. Failure Modes and Mechanisms in Electronic Packages;Singh,2012
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3. High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique
4. Effects of acrylic adhesives property and optimized bonding parameters on Sn 58Bi solder joint morphology for flex-on-board assembly
5. A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding
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