A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding-Reference-Cited by-同舟云学术

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A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Published:2015-01 Issue:1 Volume:5 Page:9-14
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Shuye Zhang ,Seung-Ho Kim ,Tae-Wan Kim ,Yoo-Sun Kim ,Kyung-Wook Paik

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/7008581/06977951.pdf?arnumber=6977951

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection;Journal of Advanced Joining Processes;2022-06

2. Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs;Vacuum;2020-10

3. A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-06

4. Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05

5. Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium;Journal of Electronic Materials;2019-11-06

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