Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Lead-free Solders in Microelectronics
2. The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders
3. The role of intermetallic compounds in lead‐free soldering
4. Mode I fracture toughness testing of eutectic Sn-Pb solder joints
5. Barrier Layers Against Diffusion
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1. Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted;Soldering & Surface Mount Technology;2022-09-30
2. Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature;Soldering & Surface Mount Technology;2021-01-13
3. Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder;International Journal of Minerals, Metallurgy, and Materials;2012-11
4. Solid–liquid equilibria, thermochemical and microstructural studies of binary organic monotectic and eutectic alloy;Journal of Thermal Analysis and Calorimetry;2012-07-17
5. Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C;Journal of Electronic Materials;2011-10-14
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