Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Lead-free Solders in Microelectronics
2. Getting Ready for Lead‐free Solders*
3. Improved mechanical properties in new, Pb-free solder alloys
4. The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution
5. The adhesion strength of A lead-free solder hot-dipped on copper substrate
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1. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints;Materials;2022-12-16
2. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames;Materials;2020-03-06
3. Evaluation on the Manufacturability of Solderable Sn Coatings Obtained by Employing Hot-Dipped Tinning Process;JOM;2019-06-19
4. Corrosion characterization of Sn-Zn solder: a review;Soldering & Surface Mount Technology;2019-02-18
5. Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution;Corrosion Science;2018-08
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