Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders-Reference-Cited by-同舟云学术

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Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Published:2007-01 Issue:2 Volume:55 Page:737-752
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

LI J,MANNAN S,CLODE M,CHEN K,WHALLEY D,LIU C,HUTT D

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Cited by 53 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Kinetics and thermodynamics of compound growth due to reactive diffusion between solid Cu and binary Bi-Sn alloys;Journal of Molecular Liquids;2022-02

5. Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions;Vacuum;2021-12

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