Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In-Reference-Cited by-同舟云学术

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Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

Published:2011-06 Issue:26 Volume:509 Page:7238-7246
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

El-Daly A.A.,El-Tantawy Farid,Hammad A.E.,Gaafar M.S.,El-Mossalamy E.H.,Al-Ghamdi A.A.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference30 articles.

1. Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases

2. Development of high strength Sn–Cu solder using copper particles at nanolength scale

3. Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder

4. Resonant characteristics of the microelectronic Sn–Cu solder

5. Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys

Cited by 47 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Cetyl Trimethyl ammonium bromide (CTAB) amount on the Nanoindentation creep behaviour of Sn-cu-Y2O3 nanocomposite Lead-free solder;Materials Characterization;2024-06

2. Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn 2Cu solder alloy;Materials Characterization;2024-03

3. Pseudo lamellae of Cu6Sn5 on the crystal facet of Sn in electrodeposited eutectic Sn-Cu lead-free solder;Materials Today Communications;2024-03

4. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12

5. The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements;Journal of Materials Science: Materials in Electronics;2022-11-01

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