Heterogeneous integration based on low-temperature bonding for advanced optoelectronic devices
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/57/i=4S/a=04FA02/pdf
Reference53 articles.
1. Moore's law: past, present and future
2. More-than-Moore 2.5D and 3D SiP Integration
3. Low Temperature Bonding for Optical Microsystems Applications
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