More-than-Moore 2.5D and 3D SiP Integration
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-52548-8.pdf
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Chiplet Placement Order Exploration based on Learning to Rank with Graph Representation;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10
2. Exploiting 2.5D/3D Heterogeneous Integration for AI Computing;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
3. Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24
4. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
5. Investigation of Miniaturized Differential Transformer Coupled Configuration Circuit Using IPD Technology in Advanced Package Integration;2023 IEEE 6th International Conference on Electronic Information and Communication Technology (ICEICT);2023-07-21
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