Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling
Author:
Affiliation:
1. Arizona State University,AZ,USA
2. University of Wisconsin-Madison,WI,USA
3. Indian Institute of Science,Bangalore,India
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10395907/10395930/10396377.pdf?arnumber=10396377
Reference15 articles.
1. An image is worth 16x16 words: Transformers for image recognition at scale;Dosovitskiy,2020
2. AI Computing in Light of 2.5D Interconnect Roadmap: Big-Little Chiplets for In-memory Acceleration
3. More-than-Moore 2.5D and 3D SiP Integration
4. Heterogeneous system partitioning and the 3d interconnect technology landscape;Beyne
5. A high-density logic-onlogic 3dic design using face-to-face hybrid wafer-bonding on 12nm finfet process;Sinha;2020 IEDM. IEEE,2020
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