Exploiting 2.5D/3D Heterogeneous Integration for AI Computing-Reference-Cited by-同舟云学术

Exploiting 2.5D/3D Heterogeneous Integration for AI Computing

Published:2024-01-22 Issue: Volume: Page:
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Container-title:2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)
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Author:

Wang Zhenyu¹,Sun Jingbo¹,Goksoy Alper²,Mandal Sumit K.³,Liu Yaotian¹,Seo Jae-Sun⁴,Chakrabarti Chaitali¹,Ogras Umit Y.²,Chhabria Vidya¹,Zhang Jeff¹,Cao Yu⁵

Affiliation:

1. Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA

2. University of Wisconsin–Madison,Department of Electrical and Computer Engineering,Madison,WI,USA

3. Indian Institute of Science,Department of Computer Science and Automation,Bangalore,India

4. Cornell Tech,Department of Electrical and Computing Engineering,NY,USA

5. University of Minnesota,Department of Electrical and Computer Engineering,Twin Cities,MN,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10473777/10473787/10473875.pdf?arnumber=10473875

Reference37 articles.

1. AI Computing in Light of 2.5D Interconnect Roadmap: Big-Little Chiplets for In-memory Acceleration

2. More-than-Moore 2.5D and 3D SiP Integration

3. Improving the Efficiency of CMOS Image Sensors through In-Sensor Selective Attention

4. Heterogeneous system partitioning and the 3d interconnect technology landscape;Beyne

5. A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process

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