Low Temperature Bonding for Optical Microsystems Applications

Abstract

This paper focuses on the low temperature bonding technology and its application for optical microsystems in use in various fields. The integration is based on the hybrid integration approach achieving high performance, small size and weight, and better cost. First, we describe the key technologies used in hybrid integration, namely low temperature bonding technology and packaging technology for realizing 3D advanced microsystems. Then, we describe various integrated microsensors that can monitor displacement, rotation angle, or blood flow in human skin.