The low pressure Cl2/O2discharge and the role of ClO
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Reference119 articles.
1. Effects of O 2 Feed Gas Impurity on Cl2 Based Plasma Etching of Polysilicon
2. Radio frequency plasma etching of Si/SiO2 by Cl2/O2 : Improvements resulting from the time modulation of the processing gases
3. Characteristics of Ru etching using ICP and helicon O2/Cl2 plasmas
4. Tungsten metal gate etching in Cl2∕O2 inductively coupled high density plasmas
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