High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling<sup>1</sup>-Reference-Cited by-同舟云学术

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling¹

Published:2022-06-13 Issue:7 Volume:27 Page:572-578
ISSN:1362-1718
Container-title:Science and Technology of Welding and Joining
language:en
Short-container-title:Science and Technology of Welding and Joining

Author:

Yang Chih-han¹,Liu Yu-chen¹,Hirata Yuki²,Nishikawa Hiroshi²,Lin Shih-kang¹³⁴⁵^ORCID

Affiliation:

1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan

2. Joining and Welding Research Institute, Osaka University, Ibaraki, Japan

3. Hierachical Green-Energy Materials (Hi-GEM) Research Center, National Cheng Kung University, Tainan, Taiwan

4. Program on Smart and Sustainable Manufacturing, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University, Tainan, Taiwan

5. Core Facility Center, National Cheng Kung University, Tainan, Taiwan

Funder

Ministry of Science and Technology, Taiwan

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/13621718.2022.2085991

Reference28 articles.

1. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

2. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

3. Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

4. Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions

5. Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C

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3. How to enhance Sn-Bi low-temperature solder by alloying?;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

4. Phase Equilibria, Thermodynamic Assessment, and Mechanical Property of the B2 Phase in the Al-Ga-Ni Ternary System;2023

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