Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
Author:
Funder
University of New South Wales
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference40 articles.
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2. The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints;Zeng;Acta Mater.,2015
3. Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders;Li;Mater. Des.,2014
4. Mechanical properties of intermetallic compounds at the Sn-3.0Ag-0.5Cu/Cu joint interface using nanoindentation;Xiao;Mater. Des.,2015
5. Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products;El-Daly;Mater. Des.,2015
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