How to enhance Sn-Bi low-temperature solder by alloying?
Author:
Affiliation:
1. National Cheng Kung University,Department of Materials Science and Engineering,Tainan,Taiwan,70101
2. Osaka University,Joining and Welding Research Institute,Osaka,Japan,567-0047
Funder
Ministry of Science and Technology
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129679.pdf?arnumber=10129679
Reference13 articles.
1. High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1
2. Effective suppression of interfacial intermetallic compound growth between Sn–58wt.% Bi solders and Cu substrates by minor Ga addition
3. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders
4. The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
5. Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions
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1. Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
3. Solubility Data of Eight Common Alloying Elements in Magnesium;Journal of Phase Equilibria and Diffusion;2023-12
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