Effective suppression of interfacial intermetallic compound growth between Sn–58wt.% Bi solders and Cu substrates by minor Ga addition
Author:
Funder
National Science Council of Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference38 articles.
1. Thermal Fatigue Behaviour of Low Melting Point Solder Joints
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